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Mindmap

Electrical/Electronic Processes

Cris Harvey BTEC Engineering BTEC Englisch

Inhalt der Mindmap

Electrical/Electronic Processes

  1. Production of circuit boards used in high-tech gadgets

  2. PCB (Printed Circuit Board)

    • Come in all shapes and sizes, from very simple to very complex
    • Manufacturing Steps
      • 1. DESIGN TO LAYOUT (normally done by a computer)
        • 2. PRODUCE THE ARTWORK - this is the position of the components and the connecting tracks
          • 3. PCB ETCHING - this prints the copper tracks onto the board (in reality you start with a full copper board and through various processes the copper is etched away leaving the tracks)
            • 4. DRILLING THE BOARD holes are drilled in the relevant place for the components to fit onto, connecting to the tracks
              • 5. POPULATING THE BOARD AND SOLDERING - solder the correct component into the correct place
  3. Surface Mount Technology (SMT)

    • A way of mass producing PCB. It involves attaching electrical components to the surface of a conductive board rather than drilling holes for the component legs
    • Advantages of SMT
      • Reduces costs of components, labour and overheads
      • Components smaller and lighter
      • Less human intervention
      • Increased production speed
      • More complex boards on smaller boards
    • SMT Process
      • 1. Apply solder paste to copper pads
        • 2. Robot places component
          • 3. Conveyor belt transports board to reflow solder oven
            • 4. Board heated so solder melts
              • 5. Components soldered to surface of board
                • 6. Finished board is inspected

Informationen

Beschreibung
BTEC BTEC Engineering Mindmap am Electrical/Electronic Processes, erstellt von Cris Harvey am 25/02/2018.
Erstellt von
Cris Harvey
Aufrufe
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