Mindmap
Electrical/Electronic Processes
Inhalt der Mindmap
Electrical/Electronic Processes
Production of circuit boards used in high-tech gadgets
PCB (Printed Circuit Board)
- Come in all shapes and sizes, from very simple to very complex
- Manufacturing Steps
- 1. DESIGN TO LAYOUT (normally done by a computer)
- 2. PRODUCE THE ARTWORK - this is the position of the components and the connecting tracks
- 3. PCB ETCHING - this prints the copper tracks onto the board (in reality you start with a full copper board and through various processes the copper is etched away leaving the tracks)
- 4. DRILLING THE BOARD holes are drilled in the relevant place for the components to fit onto, connecting to the tracks
- 5. POPULATING THE BOARD AND SOLDERING - solder the correct component into the correct place
- 4. DRILLING THE BOARD holes are drilled in the relevant place for the components to fit onto, connecting to the tracks
- 3. PCB ETCHING - this prints the copper tracks onto the board (in reality you start with a full copper board and through various processes the copper is etched away leaving the tracks)
- 2. PRODUCE THE ARTWORK - this is the position of the components and the connecting tracks
- 1. DESIGN TO LAYOUT (normally done by a computer)
Surface Mount Technology (SMT)
- A way of mass producing PCB. It involves attaching electrical components to the surface of a conductive board rather than drilling holes for the component legs
- Advantages of SMT
- Reduces costs of components, labour and overheads
- Components smaller and lighter
- Less human intervention
- Increased production speed
- More complex boards on smaller boards
- SMT Process
- 1. Apply solder paste to copper pads
- 2. Robot places component
- 3. Conveyor belt transports board to reflow solder oven
- 4. Board heated so solder melts
- 5. Components soldered to surface of board
- 6. Finished board is inspected
- 5. Components soldered to surface of board
- 4. Board heated so solder melts
- 3. Conveyor belt transports board to reflow solder oven
- 2. Robot places component
- 1. Apply solder paste to copper pads
Informationen
- Beschreibung
- BTEC BTEC Engineering Mindmap am Electrical/Electronic Processes, erstellt von Cris Harvey am 25/02/2018.
- Erstellt von
- Cris Harvey
- Aufrufe
- 1
- Bewertung