Mindmap
Computer Architecture
Inhalt der Mindmap
Computer Architecture
Function and Interconnection
- Major components
- CPU
- I/O
- Input Module: Accept data and convert them
- Output Module: Means of reporting results
- Instruction cycle
- Fetch
- Fetches instruction from mem.
- PC holds address of next instruction
- PC increments after each instructions
- Fetched instruct. loaded into IR
- Processor interprets and perform required action
- Processor Mem.
- Processor I/O
- Data processing
- Control
- Interupts
- Program
- Timer
- I/O
- Hardware failure
- Fetch
- Buses
- Control
- Address
- Elements of bus design
- Type
- Method of Arbitration
- Centralised, Distributed
- Timing
- Synch., Asynch.
- Bus Width
- Bus width
- Data trans. type
- P2P interconnection
- QPI physical layer
- QPI link layer
- QPI routing layer
- QPI protocol layer
- PCI Express
- Physical and logical arch.
- PCIe physical layer
- PCIe transaction layer
- PCIe data link layer
- Major components
Cache Memory
- Memory hierarchy
- Characteristics
- Location
- Capacity
- Unit of transfer
- principles
- Elements of cache design
- Addresses
- Size
- Mapping fuction
- Address length = (s + w) bits| Number of addressable units = 2s+w words or bytes| Block size = line size = 2w words or bytes| Number of blocks in main memory = 2^(s+ w)/2^w = 2^s| Number of lines in cache = m = 2r |Size of tag = (s – r) bits
- Because there are fewer cache lines than main memory blocks, an algorithm is needed for mapping main memory blocks into cache lines
- Direct
- Associative
- Set associative
- Number of lines in set = k Number of sets = v = 2^d| Number of lines in cache = m=kv = k * 2^d |Size of cache = k * 2^(d+w )words or bytes |Size of tag = (s – d) bits
- Victim cache
- Reduce conflict without affecting access time
- Replacement Algorithm
- Least recently used
- FIFO
- Least Frequently used
- Write policy
- Write through and write back
- Line size
- Number of caches
- Method of accessing units of data
- Sequential
- Direct
- Random
- Assiociative
- Multilevel vache
- Unified vs Split caches
Internal Memory
- Memory Cell Operation
- Read
- Select,Control, Data in
- Write
- Control, Sense, Select
- Read
- Semiconductor Mem. types
- RAM, ROM,PROM,EPROM,EEPROM,Flash mem.
- ROM
- Permanent pattern
- No power source
- No need to be loaded from 2nd storage
- Data wired into the chip(Manufacturing)
- Disadvantage
- No room for error
- Data insertion step includes a relatively large fixed cost
- PROM
- Less expensive
- Nonvolatile
- Writing process electrical
- Flexible/Convinient
- Attractive for high volume production runs
- ROM
- RAM, ROM,PROM,EPROM,EEPROM,Flash mem.
- Dynamic Ram
- SRAM
- Uses same logic elements used in processor
- Binary values are stored using traditional flip-flop logic gate configurations
- Will hold its data as long as power is supplied to it
- DRAM
- Store data as charge on capacitor
- Presence/absence of charge 1/0
- Needs periodic refreshing
- Charges leak away
- SRAM
- Interleaved mem.
- 1.DRAM
- 2.Memory bank
- 3.Banks are independent
- 4. K banks request simultaneously
- 5. Words are stored in different banks
- Error correction
- Hard failure
- Permanent physical defect
- Soft error
- Random, non-destructive event that alters the contents of one or more memory cells
- Hard failure
- Advanced DRAM org.
- SDRAM
- Widely used
- exchanges data with the processor synchronized to an external clock signal and running at the full speed of the processor/memory bus without imposing wait states
- send data once per bus clock cycle
- DDR
- can send data twice per clock cycle
- RDRAM
- delivers address and control information using an asynchronous block-oriented protocol
- CDRAM
- Integrates a small SRAM cache onto a generic DRAM chip
- SDRAM
- Memory Cell Operation
Computer Evolution and Performanc
- First Generation:Vacuum tube
- ENIAC
- 5000 additions/min
- 18000 vac. tubes
- Plugging/unplugging cables
- IAS
- memory consists of 1000 storage locations (called words) of 40 bits each
- data/instructions stored there
- No. are represented in binary/each instruction is a binary code
- ENIAC
- Registers
- (MBR): Contains a word to be stored in memory or sent to the I/O unit, or is used to receive a word from memory or from the I/O unit
- (MAR): Specifies the address in memory of the word to be written from or read into the MBR.
- (IR ): Contains the 8-bit opcode instruction being executed
- (IBR): Employed to hold temporarily the right-hand instruction from a word in memory
- (PC): Contains the address of the next instruction pair to be fetched from memory
- (AC) and (MQ): holds temporarily operands and results of ALU operations.
- Second Generation: Transitors
- Introduced
- complex arithmetic and logic units and control units
- High level programming
- Provision of system software
- Introduced
- Third Generation: Integrated circuits
- Single, self-contained transistor
- Integrated circuit
- Data storage,memory cells
- Data processing,gates
- Data movement
- Control , signal
- Moore's law
- the number of transistors that could be put on a single chip was doubling every year
- Later Generation:Semiconductor Memory Microprocessors
- Microprocessor Speed
- Pipelining
- Branch prediction
- Data flow analysis
- Speculative execution
- Performance balance
- Improvements in chip
- Increase HW speed of processor
- Increase size/speed of cache
- Change processor org. architecture
- Microprocessor Speed
- Microprocessor speed
- Pipelining
- movement of data or instructions into a conceptual pipe with all stages
- Branch prediction
- : The processor looks ahead in the instruction code fetched
- Data flow analysis
- processor analyzes which instructions are dependent on each other’s results, or data, to create an optimized schedule of instructions
- Speculative execution
- execute instructions ahead of their actual appearance in the program execution
- Pipelining
- Improvements in Chip Organization and Architecture
- Increase hardware speed of processor
- Increase size and speed of caches
- Change processor organization and architecture
- Problems with Clock Speed and Login Density
- Power
- RC delay
- Memory latency
- X86
- Embedded Systems
- Acorn RISC Machine (ARM)
- System Performance Evaluation Corporation (SPEC)
- Benchmark suite
- SPEC
- First Generation:Vacuum tube
Informationen
- Beschreibung
- Mindmap am Computer Architecture, erstellt von Ben Hur am 15/08/2015.
- Erstellt von
- Ben Hur
- Aufrufe
- 2
- Bewertung